E-beam PVD system Polyteknik E-Flex
Electron Beam Physical Vapor Deposition or EBPVD is a form of physical vapor deposition in which a material is bombarded with an electron beam under high vacuum. The electron beam causes atoms from the target to transform into the gaseous phase. These atoms then precipitate into solid form, coating everything in the vacuum chamber (within line of sight) with a thin layer of the anode material. The system is build according our specifications by Polyteknik.
Specifications
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- Polyteknik Flextura M508 E
- Sample size diameter 4” max 4mm thick
- Load lock
- Base pressure ~10-8 mbar (high vacuum; 400 l/s turbo, dry roughing pump)
- Ar etching gas, reactive gas evaporation with N2 and O2
- E-beam 10 kV 0.5 A evaporation source with 8 rotatable crucibles
- 2 thermal sources
- co-evaporation
- Source to substrate distance 500mm
- 2 Quartz thickness monitors
- Sample heating till 500 °C
- Sample rotation
- Shutter system for sources and sample
- Linear shutter 100mm resolution 10µm
- Automated recipe driven software