DISCO DAC-2SP/86 Automated Dicing Saw
During dicing, wafers are typically mounted on dicing tape which has a sticky backing that holds the wafer. Once a wafer has been diced, the samples will stay on the dicing tape until they are exposed to UV light to weaken the glue.
- Sample size max 6” wafer
- Dicing saw thickness ~75 micron
More: Wikipedia – Wafer dicing