Silicon waveguide

DISCO DAC-2SP/86 Automated Dicing Saw


During dicing, wafers are typically mounted on dicing tape which has a sticky backing that holds the wafer. Once a wafer has been diced, the samples will stay on the dicing tape until they are exposed to UV light to weaken the glue. 



  • Sample size max 6” wafer
  • Dicing saw thickness ~75 micron

More: Wikipedia – Wafer dicing