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RF discharge for etching of silicon based thin films. Dedicated system for plasma etching of Si, SiO2, Si3N4 with low sidewall roughness. It‘s not allowed to etch metals. Specifications Oxford PlasmaPro100 Cobra gas inlet system …
R.W. Tjerkstra, F.B. Segerink, J.J. Kelly and W.L. Vos, Fabrication of three-dimensional nanostructures by focused ion beam milling, J. Vac. Sci. Technol. B 26, 973-977 (2008)
C.G. de Koster, M.C. Duursma, G.J. van Rooij, R.M.A. Heeren and J.J. Boon, Endgroup analysis of polyethylene glycol polymers by matrix-assisted laser desorption/ionization Fourier-transform ion cyclotron resonance mass spectrometry, Rapid Commun. Mass Spectrom. 9, 957-962 (1995)
A. Sthoer, E.M. Adams, S. Sengupta, R.W. Corkery, H.C. Allen and E.C. Tyrode, La3+ and Y3+ interactions with the carboxylic acid moiety at the liquid/vapor interface: Identification of binding complexes, charge reversal, and detection limits, J. Colloid Interface Sci. 608, (2), 2169-2180 (2022)
D. Mizuno, M. Atakhorrami, K M. Addas, J X. Tang, G.H. Koenderink, F.C. MacKintosh and C.F. Schmidt: Laser trapping and laser interferometry for high-bandwidth micromechanical probing of biomaterialsIn: Asia Optical Fiber Communication and Optoelectronic Exposition and Conference, OSA Technical Digest : conference October 30 - November 2, Shanghai, China, Optical Society of America, 2008.
S.A. de Vries, W.J. Huisman, P. Goedtkindt, M.J. Zwanenburg, S.L. Bennett and E. Vlieg, Floating stacking fault during homoepitaxial growth of Ag(111), Phys.Rev.Lett. 81, 381-384 (1998)
P.M. Bendix, G.H. Koenderink, D. Cuvelier, Z. Dogic, B.N. Koeleman, W.M. Brieher, C.M. Field, L. Mahadevan and D.A. Weitz, A quantitative analysis of contractility in active cytoskeletal protein networks, Biophys. J. 94, 3126-3136 (2008)